US 12,356,737 B2
Imaging apparatus and manufacturing method of the same
Mutsuo Tsuji, Kanagawa (JP); and Daisuke Chino, Kanagawa (JP)
Assigned to SONY SEMISCONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/780,230
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Sep. 30, 2020, PCT No. PCT/JP2020/037164
§ 371(c)(1), (2) Date May 26, 2022,
PCT Pub. No. WO2021/111716, PCT Pub. Date Jun. 10, 2021.
Claims priority of application No. 2019-219540 (JP), filed on Dec. 4, 2019.
Prior Publication US 2022/0415937 A1, Dec. 29, 2022
Int. Cl. H10F 39/00 (2025.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01)
CPC H10F 39/80 (2025.01) [H01L 23/14 (2013.01); H01L 23/31 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An imaging apparatus, comprising:
an imaging element that includes an imaging chip, pads, and a light transmission section configured to transmit incident light, wherein
the light transmission section is on the imaging chip,
the imaging chip is configured to generate an image signal based on the incident light that has transmitted through the light transmission section,
the pads are on a bottom surface of the imaging chip that is different from a top surface of the imaging chip on which the light transmission section is present, and
the pads are configured to convey the generated image signal;
a wiring substrate that includes wiring that is connected to the pads,
wherein the imaging element is on a front surface of the wiring substrate;
a sealing section adjacent to side surfaces of the imaging chip, wherein
the sealing section is on side surfaces of the wiring substrate,
the side surfaces of the wiring substrate are adjacent to the front surface of the wiring substrate,
the imaging chip is on the wiring substrate,
the side surfaces of the imaging chip are adjacent to the bottom surface of the imaging chip, and
the side surfaces of the imaging chip are configured to seal the imaging chip; and
fitting sections in the sealing section, wherein
a part of a lens unit fits into the fitting sections, and
the lens unit is configured to form an optical image on the imaging element.