US 12,356,717 B2
Array substrate and manufacturing method thereof, and display panel
Qian Ma, Shenzhen (CN); and Wei Lu, Shenzhen (CN)
Assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shenzhen (CN)
Appl. No. 17/778,855
Filed by SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shenzhen (CN)
PCT Filed Apr. 24, 2022, PCT No. PCT/CN2022/088806
§ 371(c)(1), (2) Date May 22, 2022,
PCT Pub. No. WO2023/197368, PCT Pub. Date Oct. 19, 2023.
Claims priority of application No. 202210391961.4 (CN), filed on Apr. 14, 2022.
Prior Publication US 2024/0178240 A1, May 30, 2024
Int. Cl. H10D 30/67 (2025.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01)
CPC H10D 86/60 (2025.01) [H10D 86/021 (2025.01); H10D 86/451 (2025.01)] 20 Claims
OG exemplary drawing
 
1. An array substrate, comprising:
a substrate;
an oxide semiconductor layer disposed on the substrate, comprising a channel region and conductive regions located at both sides of the channel region;
a gate insulating layer disposed on a side of the oxide semiconductor layer away from the substrate;
a gate electrode disposed on a side of the gate insulating layer away from the substrate;
an interlayer insulating layer disposed on a side of the gate electrode away from the substrate; and
a source-drain electrode metal layer disposed on a side of the interlayer insulating layer away from the substrate, and electrically connected to the conductive regions through via holes penetrating the interlayer insulating layer;
wherein edges of the gate insulating layer are respectively overlapped with the conductive regions on the both sides of the channel region, and an orthographic projection of a part of the gate electrode corresponding to the oxide semiconductor layer on the substrate falls within a range of an orthographic projection of the channel region on the substrate; and
wherein the interlayer insulating layer comprises a first interlayer insulating layer and a second insulating layer, the first interlayer insulating layer is located at a side surface of the second insulating layer close to the substrate, and the gate electrode and the gate insulating layer are exposed from the first interlayer insulating layer.