US 12,356,684 B2
Semiconductor structure having asymmetric source/drain regions
Hsing-I Tsai, Hsinchu (TW); Fu-Huan Tsai, Kaohsiung (TW); Chia-Chung Chen, Keelung (TW); Hsiao-Chun Lee, Chiayi (TW); Chi-Feng Huang, Hsinchu County (TW); Cho-Ying Lu, Hsinchu (TW); and Victor Chiang Liang, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Nov. 14, 2023, as Appl. No. 18/508,260.
Application 18/508,260 is a continuation of application No. 17/463,507, filed on Aug. 31, 2021, granted, now 11,855,145.
Prior Publication US 2024/0088224 A1, Mar. 14, 2024
Int. Cl. H10D 62/13 (2025.01); H10D 30/60 (2025.01); H10D 64/27 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 89/10 (2025.01)
CPC H10D 62/151 (2025.01) [H10D 64/519 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor structure comprising:
a first gate structure;
a second gate structure coupled to the first gate structure;
a source region surrounded by the first gate structure and the second gate structure;
a first drain region separated from the source region by the first gate structure; and
a second drain region separated from the source region by the second gate structure; and
wherein a shape of the first drain region and a shape of the second drain region are different from each other from a plan view, and
wherein a first interface is between the first gate structure and the first drain region, a second interface is between the first gate structure and the source region, and a length of the first interface is different from a length of the second interface.