US 12,356,665 B2
Stacked transistors having an isolation region therebetween and a common gate electrode, and related fabrication methods
Seungchan Yun, Waterford, NY (US); Inchan Hwang, Schenectady, NY (US); Gunho Jo, Albany, NY (US); Jeonghyuk Yim, Halfmoon, NY (US); Byounghak Hong, Latham, NY (US); Kang-ill Seo, Latham, NY (US); Ming He, San Jose, CA (US); JaeHyun Park, Hwaseong-si (KR); Mehdi Saremi, Danville, CA (US); Rebecca Park, Mountain View, CA (US); Harsono Simka, Saratoga, CA (US); and Daewon Ha, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 17, 2021, as Appl. No. 17/554,483.
Claims priority of provisional application 63/270,873, filed on Oct. 22, 2021.
Claims priority of provisional application 63/247,389, filed on Sep. 23, 2021.
Prior Publication US 2023/0086084 A1, Mar. 23, 2023
Int. Cl. H10D 30/67 (2025.01); H10D 30/62 (2025.01); H10D 64/23 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01)
CPC H10D 30/6735 (2025.01) [H10D 64/258 (2025.01); H10D 84/0135 (2025.01); H10D 84/0151 (2025.01); H10D 84/038 (2025.01); H10D 30/62 (2025.01)] 18 Claims
OG exemplary drawing
 
1. A transistor device comprising:
a substrate;
a lower transistor comprising a lower gate, a lower channel region on the substrate, lower insulating spacers on sidewalls of the lower gate, and a lower source/drain region;
an upper transistor comprising an upper gate, an upper channel region, upper insulating spacers on sidewalls of the upper gate, and an upper source/drain region, wherein the lower transistor is between the upper transistor and the substrate; and
an isolation region that separates the lower insulating spacers from the upper insulating spacers, the isolation region comprising a first portion that separates the lower channel region from the upper channel region and a second portion that separates the lower source/drain region from the upper source/drain region,
wherein the lower gate of the lower transistor contacts the upper gate of the upper transistor, and
wherein the first portion of the isolation region has a first thickness that is less than or equal to a second thickness of the second portion of the isolation region.