US 12,356,596 B2
Display substrate and display device
Yaya Qi, Beijing (CN); Dianzheng Dong, Beijing (CN); Yan Yan, Beijing (CN); Xiao Wang, Beijing (CN); Xue Wang, Beijing (CN); Tingting Wang, Beijing (CN); Xiaoying Li, Beijing (CN); and Zhiqiang Ma, Beijing (CN)
Assigned to BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed by BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Filed on Sep. 25, 2023, as Appl. No. 18/372,298.
Application 18/372,298 is a continuation of application No. 17/433,164, granted, now 11,805,630, previously published as PCT/CN2021/075809, filed on Feb. 7, 2021.
Claims priority of application No. 202010101579.6 (CN), filed on Feb. 19, 2020.
Prior Publication US 2024/0015939 A1, Jan. 11, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/02 (2006.01); H05F 3/00 (2006.01); H05K 9/00 (2006.01)
CPC H05K 9/0067 (2013.01) [H05F 3/00 (2013.01); H05K 1/02 (2013.01); H05K 9/0064 (2013.01); G02F 2202/22 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A display device, comprising a display substrate, with the display substrate comprising a display area and a bonding area positioned on a side of the display area,
wherein the bonding area comprises a plurality of bonding sub-areas arranged at intervals, the bonding sub-areas are arranged along a direction in which an edge of the display area extends and configured for bonding a chip-on-film,
the bonding area is provided with a first antistatic layer thereon, at least a part of the first antistatic layer is located between adjacent ones of the bonding sub-areas, and the first antistatic layer is electrically coupled to a reference signal terminal,
the display device further comprises a chip-on-film, one end of the chip-on-film is bound with the bonding sub-area, and another end of the chip-on-film is bound with a driving circuit board,
the driving circuit board is provided with a ground terminal thereon, and the reference signal terminal is electrically coupled to the ground terminal on the driving circuit board through the chip-on-film, and
the first antistatic layer partially overlaps the chip-on-film adjacent to the first antistatic layer in a first direction, with the first direction being a direction in which the bonding area and the display area are arranged.