US 12,356,590 B2
Cooling apparatus
Takashi Moriyama, Tokyo (JP); Hiroaki Ishikawa, Tokyo (JP); Tomohiko Saito, Tokyo (JP); and Tatsuya Kusashima, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Appl. No. 18/008,685
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Aug. 4, 2020, PCT No. PCT/JP2020/029826
§ 371(c)(1), (2) Date Dec. 7, 2022,
PCT Pub. No. WO2022/029889, PCT Pub. Date Feb. 10, 2022.
Prior Publication US 2023/0232588 A1, Jul. 20, 2023
Int. Cl. B64G 1/58 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/2039 (2013.01) [B64G 1/58 (2013.01); H05K 7/20327 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A cooling apparatus to cool a heat-generating instrument installed in an installation apparatus, the cooling apparatus comprising:
a pump for circulating refrigerant in a liquid state;
a cooler for cooling the heat-generating instrument with the refrigerant;
a radiator for cooling the refrigerant;
a refrigerant flow path that is configured circularly by sequentially connecting the pump, the cooler and the radiator;
a discharge-side heat exchanger that is provided in the refrigerant flow path between the pump and the cooler;
a suction-side heat exchanger provided in the refrigerant flow path between the radiator and the pump; and
a Peltier device provided between the discharge-side heat exchanger and the suction-side heat exchanger, the Peltier device being for transferring heat from the refrigerant flowing through the suction-side heat exchanger to the refrigerant flowing through the discharge-side heat exchanger.