US 12,356,585 B2
Cooling module for providing enhanced localized cooling of a heatsink
Joo Han Kim, Huntsville, AL (US); Lucius Akalanne, Wiltshire (GB); and Brian Hoden, Albuquerque, NM (US)
Assigned to ABACO SYSTEMS, INC., Huntsville, AL (US)
Appl. No. 18/265,059
Filed by ABACO SYSTEMS, INC., Huntsville, AL (US)
PCT Filed Dec. 23, 2020, PCT No. PCT/US2020/066758
§ 371(c)(1), (2) Date Jun. 2, 2023,
PCT Pub. No. WO2022/139829, PCT Pub. Date Jun. 30, 2022.
Prior Publication US 2024/0032255 A1, Jan. 25, 2024
Int. Cl. H05K 7/20 (2006.01); H01L 23/473 (2006.01)
CPC H05K 7/20254 (2013.01) [H05K 7/20509 (2013.01); H05K 7/20518 (2013.01); H01L 23/473 (2013.01); H05K 7/20772 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A heatsink having enhanced localized cooling, said heatsink comprising:
a wall;
a heatframe,
a coolant channel between the wall and the heatframe, wherein a coolant flows through the coolant channel; and
a porous media having a volume, wherein at least a portion of the volume of the porous media extends through the heatframe, through the coolant channel, and through the wall, wherein seal plates seal the heatframe and the wall so that the coolant does not flow through the porous media and out the heatframe or out the wall,
wherein the wall and/or the heatframe proximate to the porous media provides enhanced localized cooling to at least a portion of a heat producing device that is at least in partial contact with the wall or the heatframe proximate to the porous media.