US 12,356,583 B2
Heat dissipation module and electronic device
Chun-Yuan Chen, New Taipei (TW)
Assigned to Nanning FuLian FuGui Precision Industrial Co., Ltd., Nanning (CN)
Filed by Nanning FuLian FuGui Precision Industrial Co., Ltd., Nanning (CN)
Filed on Jul. 12, 2023, as Appl. No. 18/220,866.
Prior Publication US 2025/0024633 A1, Jan. 16, 2025
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20172 (2013.01) [H05K 7/20145 (2013.01); H05K 7/20745 (2013.01)] 18 Claims
OG exemplary drawing
 
10. An electronic device comprising:
a shell defining an installation slot;
a heat dissipation module detachably installed in the installation slot, the heat dissipation module comprising:
a housing comprising a top plate and two side walls connected to opposite ends of the top plate, the top plate and the two side walls define a receiving space, the top plate defines a mounting hole, and each of the two side walls defines a through hole;
a fan accommodated in the receiving space, the fan is configured for generating airflow from one of the two side walls to another one of the two side walls;
a turntable rotatably positioned in the mounting hole; and
an expansion mechanism accommodated in the receiving space, the expansion mechanism comprises two sets of linkage assemblies symmetrically arranged relative to the turntable, and the two sets of linkage assemblies are connected to the turntable, the turntable is configured for selectively rotating into a locked position, where the two sets of linkage assemblies extend through the through holes on the two side walls and protrude from the housing, and the turntable is configured for selectively rotating to deviate from the locked position, for the two sets of linkage assemblies to retract into the housing via the through holes on the two side walls; and
the housing has a symmetrical shape such that the heat dissipation module can be turned over and reinstalled in the electronic device to change the airflow direction of the heat dissipation module.