US 12,356,550 B2
Sandwich structure power supply module
Daocheng Huang, Santa Clara, CA (US); Wenyang Huang, Hangzhou (CN); Yishi Su, Hangzhou (CN); Yingxin Zhou, Hangzhou (CN); and Xinmin Zhang, San Jose, CA (US)
Assigned to Monolithic Power Systems, Inc., San Jose, CA (US)
Filed by Monolithic Power Systems, Inc., San Jose, CA (US)
Filed on Aug. 1, 2022, as Appl. No. 17/878,356.
Application 17/878,356 is a continuation in part of application No. 17/589,277, filed on Jan. 31, 2022.
Application 17/589,277 is a continuation in part of application No. 17/197,394, filed on Mar. 10, 2021.
Prior Publication US 2022/0369464 A1, Nov. 17, 2022
Int. Cl. H05K 1/18 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/181 (2013.01) [H01L 23/367 (2013.01); H01L 23/49562 (2013.01); H01L 23/5286 (2013.01); H01L 23/66 (2013.01); H05K 1/0237 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A power supply module, comprising: at least one inductor modules, wherein each inductor module has a magnetic core and two windings passing through the magnetic core; a top PCB (Printed Circuit Board) mounted on top of the at least one inductor modules; and at least one pair of power device chips mounted on top of the top PCB, wherein each pair of the at least one pair of the power device chips are mounted on the too PCB over an associated inductor module, and wherein each one of the pair of the power device chips has at least one pin connected to the associated winding of the associated inductor module via the top PCB: wherein each of the at least one inductor modules is wrapped by a plurality of metal layers configured as power pins and signal pins for connecting the top PCB and a board that the inductor module is attached to; and further wherein each inductor module has a height measured from a surface of a bottom side of the inductor module to a surface of a top side of the inductor module of at most 3 mm.