US 12,356,548 B2
Electronic device including flexible printed circuit board
Hyunmo Yang, Gyeonggi-do (KR); Junwhon Uhm, Gyeonggi-do (KR); Jungkeun Lee, Gyeonggi-do (KR); Yonghyun Park, Gyeonggi-do (KR); Junmyeong Jeong, Gyeonggi-do (KR); and Myeongjae Hong, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd, (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Dec. 17, 2021, as Appl. No. 17/554,217.
Application 17/554,217 is a continuation of application No. PCT/KR2021/017767, filed on Nov. 29, 2021.
Claims priority of application No. 10-2021-0027455 (KR), filed on Mar. 2, 2021.
Prior Publication US 2022/0287180 A1, Sep. 8, 2022
Int. Cl. H05K 1/14 (2006.01); G02B 27/01 (2006.01); H05K 1/02 (2006.01); H05K 5/02 (2006.01)
CPC H05K 1/147 (2013.01) [G02B 27/01 (2013.01); H05K 1/0298 (2013.01); H05K 1/141 (2013.01); H05K 5/0226 (2013.01); H05K 2201/10128 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a frame;
a housing including a first temple connected to one side of the frame and a second temple connected to an opposite side of the frame;
a first printed circuit board (PCB) partially located in the first temple;
a first flexible printed circuit board (FPCB) electrically connected to the first PCB; and
a second FPCB electrically connected to the first PCB,
wherein the first FPCB includes:
a first overlapping portion extracted from the first PCB in a first direction and configured to overlap the second FPCB, and
a first branch extending from the first overlapping portion and configured not to overlap the second FPCB, the first branch being formed in a lower portion of the frame, and
wherein the second FPCB includes:
a second overlapping portion extracted from the first PCB in the first direction and configured to overlap the first FPCB, and
a second branch extending from the second overlapping portion and configured not to overlap the first FPCB, the second branch being formed in an upper portion of the frame.