US 12,356,547 B2
Printed circuit board
Man Gon Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 31, 2023, as Appl. No. 18/104,052.
Claims priority of application No. 10-2022-0105672 (KR), filed on Aug. 23, 2022; and application No. 10-2022-0124825 (KR), filed on Sep. 30, 2022.
Prior Publication US 2024/0074057 A1, Feb. 29, 2024
Int. Cl. H05K 1/00 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/116 (2013.01) [H05K 2201/09481 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09827 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a first insulating layer;
a through-hole penetrating a region between an upper surface and a lower surface of the first insulating layer;
a first via disposed in at least a portion of the through-hole;
a first pad connected to an upper side of the first via; and
a second pad connected to a lower side of the first via,
wherein a width of the through-hole on an uppermost side is greater than a width of the first pad, and
wherein at least a portion of an upper surface of the first via exposed from the first pad is recessed below the upper surface of the first insulating layer.