US 12,356,543 B2
Wiring module
Shinichiro Yoshida, Osaka (JP); Osamu Nakayama, Osaka (JP); and Kotaro Takada, Osaka (JP)
Assigned to SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/275,300
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Feb. 2, 2022, PCT No. PCT/JP2022/003928
§ 371(c)(1), (2) Date Aug. 1, 2023,
PCT Pub. No. WO2022/176609, PCT Pub. Date Aug. 25, 2022.
Claims priority of application No. 2021-026268 (JP), filed on Feb. 22, 2021.
Prior Publication US 2024/0107663 A1, Mar. 28, 2024
Int. Cl. H05K 1/02 (2006.01); B60R 16/02 (2006.01); H05K 3/20 (2006.01)
CPC H05K 1/028 (2013.01) [B60R 16/0207 (2013.01); H05K 3/20 (2013.01); H05K 2201/10181 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A wiring module comprising a flexible printed wiring board to be electrically connected to a plurality of power storage elements,
wherein the flexible printed wiring board includes:
a base film that has insulating properties and has a first surface and a second surface;
an adhesive layer that has adhesive properties and is stacked onto the first surface of the base film;
a conductive path that is stacked onto the first surface of the base film using the adhesive layer; and
a coverlay that is stacked onto the first surface of the base film using the adhesive layer, and covers the first surface of the base film and the conductive path,
the conductive path has a fuse portion forming a part of a circuit and having a smaller cross-sectional area than another part of the conductive path, and
a resin portion that includes a synthetic resin with insulating properties is formed on a portion of the second surface of the base film that corresponds to the fuse portion, and on a portion of an outer surface of the coverlay that corresponds to the fuse portion.