US 12,356,538 B2
Electronic component module
Tadashi Nomura, Nagaokakyo (JP); and Ryohei Okabe, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto-fu (JP)
Filed on Feb. 7, 2023, as Appl. No. 18/165,582.
Application 18/165,582 is a continuation of application No. PCT/JP2021/023405, filed on Jun. 21, 2021.
Claims priority of application No. 2020-139543 (JP), filed on Aug. 20, 2020.
Prior Publication US 2023/0189429 A1, Jun. 15, 2023
Int. Cl. H01L 23/552 (2006.01); H01L 23/544 (2006.01); H01L 25/16 (2023.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0218 (2013.01) [H01L 23/544 (2013.01); H01L 23/552 (2013.01); H01L 25/16 (2013.01); H05K 1/0269 (2013.01); H05K 1/186 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09936 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate;
a component mounted on a top surface being one principal surface of the substrate;
a first shielding film provided on a top surface and a side surface of the component;
a sealing resin provided on the top surface of the substrate and sealing the component; and
a second shielding film provided on a top surface of the sealing resin, wherein
a hole is provided on the top surface of the sealing resin to reach at least a part of the first shielding film,
the second shielding film disposed in the hole is brought into contact with the first shielding film at positions facing the top surface and the side surface of the component,
a recess is provided on the top surface of the sealing resin in a manner recessed toward the top surface of the substrate,
a depth of the hole is greater than a depth of the recess, and
each of the hole and the recess delineates an identifier including at least one of a character, a number, a symbol, a dot-shaped recognition code, a barcode, a two-dimensional code, a logo, and a graphic, in a plan view of the sealing resin.