US 12,356,056 B1
Mechanical assembly for camera systems
Gregory Cartagena, New York, NY (US); Dincer Bozkaya, Andover, MA (US); Sara Jean Woo, Andover, MA (US); and Caroline Anne Keely, Wakefield, MA (US)
Assigned to Amazon Technologies, Inc., Seattle, WA (US)
Filed by Amazon Technologies, Inc., Seattle, WA (US)
Filed on Jun. 29, 2022, as Appl. No. 17/853,592.
Int. Cl. H04N 23/52 (2023.01); G02B 7/02 (2021.01); H04N 13/239 (2018.01); H04N 23/45 (2023.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01)
CPC H04N 23/45 (2023.01) [G02B 7/028 (2013.01); H04N 13/239 (2018.05); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04N 23/55 (2023.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a housing comprising a first thermally conductive material; and
a plurality of image sensor assemblies, wherein a first image sensor assembly of the plurality of image sensor assemblies comprises:
a first circuit board;
a first image sensor disposed on the first circuit board;
a first optics holder comprising a second thermally conductive material and attached to the housing through the first circuit board, wherein the first circuit board is disposed between the first optics holder and the housing, wherein the first optics holder comprises a plurality of extended surfaces that extend in a direction away from the first circuit board, wherein the plurality of extended surfaces are adapted to transfer heat away from the first image sensor, wherein a surface of the first optics holder is in contact with a portion of a surface of the first circuit board and wherein the first optics holder comprises a support location; and
a first optical lens disposed in the support location of the first optics holder.