US 12,355,473 B2
Radio-frequency module and communication device
Motoji Tsuda, Kyoto (JP); Yukiya Yamaguchi, Kyoto (JP); and Takanori Uejima, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Mar. 14, 2023, as Appl. No. 18/183,297.
Application 18/183,297 is a continuation of application No. PCT/JP2021/041623, filed on Nov. 11, 2021.
Claims priority of application No. 2020-195438 (JP), filed on Nov. 25, 2020.
Prior Publication US 2023/0223968 A1, Jul. 13, 2023
Int. Cl. H04B 1/00 (2006.01); H04B 1/04 (2006.01)
CPC H04B 1/0078 (2013.01) [H04B 1/0458 (2013.01); H04B 2001/0408 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a first base including a low-noise amplifier circuit, wherein at least a part of the first base is comprised of a first semiconductor material having a first thermal conductivity;
a second base including a power amplifier circuit, wherein at least a part of the second base is comprised of a second semiconductor material having a second thermal conductivity lower than the first thermal conductivity of the first base; and
a module substrate having a principal surface, wherein the first base and the second base are disposed on the principal surface,
wherein the first base is joined to the principal surface with a first electrode interposed in between,
wherein the second base is disposed between the module substrate and the first base in cross-sectional view, and is joined to the principal surface with a second electrode interposed in between, and
wherein at least a part of the first base overlaps at least a part of the second base in plan view.