US 12,355,413 B2
Cap substrate for acoustic wave device
Wilfred Ryan Vidamo Habana, Singapore (SG); Hidekazu Nakanishi, Sakai (JP); XiaoJun Chew, Singapore (SG); and Mitsuhiro Furukawa, Nishinomiya (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Apr. 6, 2022, as Appl. No. 17/658,180.
Claims priority of provisional application 63/201,225, filed on Apr. 19, 2021.
Claims priority of provisional application 63/201,223, filed on Apr. 19, 2021.
Prior Publication US 2022/0337217 A1, Oct. 20, 2022
Int. Cl. H03H 3/02 (2006.01); H03H 9/10 (2006.01); H03H 9/54 (2006.01)
CPC H03H 3/02 (2013.01) [H03H 9/105 (2013.01); H03H 9/54 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A packaged acoustic wave component comprising:
a device substrate;
an acoustic wave device mounted on the device substrate;
a peripheral wall attached to the device substrate and surrounding the acoustic wave device; and
a cap substrate attached to the peripheral wall and spaced above the device substrate, the cap substrate having a marking layer disposed on a bottom surface of the cap substrate that is spaced from and faces the acoustic wave device, the marking layer configured to receive one or more markings thereon, the one or more markings being coordinates associated with a location of the cap substrate on a parent wafer.