US 12,355,206 B2
Light emitting device, projector, and display
Takashi Miyata, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on Mar. 28, 2022, as Appl. No. 17/705,808.
Claims priority of application No. 2021-054824 (JP), filed on Mar. 29, 2021.
Prior Publication US 2022/0311210 A1, Sep. 29, 2022
Int. Cl. H01S 5/042 (2006.01); G03B 21/20 (2006.01); G03B 33/12 (2006.01); H01S 5/34 (2006.01); H01S 5/343 (2006.01)
CPC H01S 5/04256 (2019.08) [G03B 21/2033 (2013.01); H01S 5/04257 (2019.08); H01S 5/341 (2013.01); H01S 5/34333 (2013.01); G03B 33/12 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A light emitting device comprising:
a substrate;
a laminated structure provided to the substrate, and including a plurality of columnar parts;
a first electrode and a second electrode configured to inject an electrical current into the plurality of columnar parts, the first electrode being ring-shaped and completely surrounding the plurality of columnar parts in a plan view;
a first wiring layer electrically connected to the first electrode; and
an insulating layer configured to cover the laminated structure and the first electrode, wherein
each of the plurality of columnar parts includes
a first semiconductor layer having a first conductivity type,
a second semiconductor layer having a second conductivity type different from the first conductivity type, and
a light emitting layer disposed between the first semiconductor layer and the second semiconductor layer,
the first semiconductor layer is disposed between the substrate and the light emitting layer,
the laminated structure includes a third semiconductor layer having the first conductivity type disposed between the substrate and the plurality of columnar parts,
the first electrode is electrically connected to the first semiconductor layer via the third semiconductor layer,
a contact hole is disposed in the insulating layer at a position overlapping the first electrode in the plan view,
the first wiring layer is provided to the insulating layer, and
the first wiring layer is electrically connected to the first electrode via the contact hole.