CPC H01P 1/20 (2013.01) [H01P 3/06 (2013.01); H01P 11/005 (2013.01)] | 15 Claims |
1. An electronic structure comprising:
a signal transmission line;
an impedance modification element adjacent to and external to the signal transmission line, wherein the impedance modification element comprises a structure having differentiated sections, along the signal transmission line, that provide corresponding differentiated impedances, wherein the impedance modification element comprises a plurality of impedance sub-elements spaced apart from one another along or adjacent the signal transmission line,
wherein a first spacing between an outer periphery of the signal transmission line and a first impedance sub-element of the plurality of impedance sub-elements is greater than a second spacing between the outer periphery of the signal transmission line and a second impedance sub-element of the plurality of impedance sub-elements, or
wherein a first spacing between an outer periphery of the signal transmission line and a first impedance sub-element of the plurality of impedance sub-elements is greater than a second spacing between the outer periphery of the signal transmission line and a second impedance sub-element of the plurality of impedance sub-elements; and
a substrate, wherein the signal transmission line is disposed between the substrate and the impedance modification element.
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