US 12,355,018 B2
Display panel and display device
Yi-Hsin Lin, Hsinchu (TW); and Wen-Lung Chen, Hsinchu (TW)
Assigned to AUO Corporation, Hsinchu (TW)
Filed by AUO Corporation, Hsinchu (TW)
Filed on Dec. 6, 2022, as Appl. No. 18/075,423.
Claims priority of application No. 111141745 (TW), filed on Nov. 2, 2022.
Prior Publication US 2024/0145453 A1, May 2, 2024
Int. Cl. H01L 23/498 (2006.01); G09F 9/30 (2006.01); G09F 9/33 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H10H 20/857 (2025.01)
CPC H01L 25/165 (2013.01) [H01L 25/0753 (2013.01); H01L 25/167 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A display panel, comprising:
a circuit substrate, having a first surface, a second surface opposite to the first surface, and a side surface connected to the first surface and the second surface, wherein the circuit substrate comprises a circuit structure located on the first surface, and the first surface comprises a display region and a peripheral region;
a plurality of light emitting elements, disposed on the display region;
a side wire, comprising:
a first bonding portion, disposed on the first surface and bonded to the circuit structure;
a first extension portion, disposed on the side surface;
a second extension portion, disposed on the second surface and overlapped with the peripheral region in a normal direction of the second surface; and
a second bonding portion, disposed on the second surface and overlapped with the display region in the normal direction of the second surface, wherein the first bonding portion, the first extension portion, the second extension portion, and the second bonding portion are sequentially connected and have a same resistivity; and
a chip-on-film package structure, electrically connected to the second bonding portion.