US 12,355,012 B2
Ceramic-insulated multi-metal substrate structure with integrated coating film for high-performance light-emitting devices
Koji Ichikawa, Tokyo-to (JP); and Hiroshi Nakai, Tokyo-to (JP)
Assigned to STANLEY ELECTRIC CO., LTD., Tokyo (JP)
Filed by Stanley Electric Co., Ltd., Tokyo (JP)
Filed on Mar. 28, 2022, as Appl. No. 17/705,495.
Claims priority of application No. 2021-17175 (JP), filed on Feb. 5, 2021.
Prior Publication US 2022/0328461 A1, Oct. 13, 2022
Int. Cl. H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/831 (2025.01); H10H 20/841 (2025.01); H10H 20/851 (2025.01)
CPC H01L 25/0753 (2013.01) [H10H 20/01 (2025.01); H10H 20/8312 (2025.01); H10H 20/841 (2025.01); H10H 20/8514 (2025.01); H10H 20/034 (2025.01)] 17 Claims
OG exemplary drawing
 
1. A substrate structure comprising:
a plurality of substrates that are placed side by side to be separated from one another with a clearance interposed therebetween and are each made of metal;
an insulating portion made of ceramic that is formed so as to fill the clearance; and
an insulating upper surface coating film formed so as to integrate the plurality of substrates and integrally cover the upper surfaces of the plurality of substrates and having an opening portion that spreads over the upper surface of one substrate among the plurality of substrates and the upper surface of another substrate adjacent to the one substrate across the clearance, the opening portion exposing an element placing region for placing an element,
wherein the planar shape of the integrated substrates is a rectangle, the plurality of substrates are made of copper or an alloy with copper as a main material, the insulating portion is made of glass body having a siloxane bond and containing the metal oxide of alumina, zirconia, or silica, the clearances between the respective substrates and the insulating portions that fill the clearances have a crank shape in top view, and the edges of the bottom surface of the substrates along the clearances are recessed so that the binding areas between the respective substrates and the insulating portions are increased.