US 12,355,004 B2
Semiconductor chip and semiconductor package
Junyeong Heo, Suwon-si (KR); Yeongkwon Ko, Hwaseong-si (KR); Unbyoung Kang, Hwaseong-si (KR); and Teakhoon Lee, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Feb. 9, 2022, as Appl. No. 17/667,989.
Claims priority of application No. 10-2021-0076236 (KR), filed on Jun. 11, 2021.
Prior Publication US 2022/0399311 A1, Dec. 15, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/78 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/33181 (2013.01); H01L 2225/06555 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a first semiconductor chip;
a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip in a first direction; and
an insulating adhesive layer between the first semiconductor chip, the plurality of second semiconductor chips, and each of the plurality of second semiconductor chips, the insulating adhesive layer including an adhesive fillet protruding from between at least the first semiconductor chip and the plurality of second semiconductor chips,
wherein the first semiconductor chip, the plurality of second semiconductor chips, and the insulating adhesive layer are arranged as to define a grooving recess in the semiconductor package, the grooving recess including a first recess and a second recess adjacent to the first recess, the first recess and the second recess being arranged in a second direction substantially perpendicular to the first direction and substantially parallel to an edge of the first semiconductor chip, and
wherein a step portion between an uppermost surface of the adhesive fillet and the first semiconductor chip defines the first recess, and a step portion between an uppermost surface of the first semiconductor chip and a recessed surface inside the first semiconductor chip adjacent to the first recess defines the second recess.