US 12,355,000 B2
Package comprising a substrate and a high-density interconnect integrated device
Yangyang Sun, San Diego, CA (US); Li-Sheng Weng, San Diego, CA (US); and Zhimin Song, San Diego, CA (US)
Assigned to QUALCOMM INCORPORATED, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Nov. 10, 2020, as Appl. No. 17/094,303.
Prior Publication US 2022/0149005 A1, May 12, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/0655 (2013.01) [H01L 21/56 (2013.01); H01L 23/31 (2013.01); H01L 23/5381 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A package comprising:
a substrate comprising a cavity that extends through an entire thickness of the substrate;
a first integrated device coupled to the substrate, wherein the first integrated device includes a first front side that faces in a direction towards the substrate;
a second integrated device coupled to the substrate, wherein the second integrated device includes a second front side that faces in a direction towards the substrate;
an interconnect integrated device coupled to the first integrated device and the second integrated device, wherein the interconnect integrated device is located (i) over the cavity of the substrate and (ii) only partially in the cavity of the substrate; and
an underfill configured to underfill the first integrated device and the second integrated device, the underfill located (i) between the first integrated device and the substrate, (ii) between the second integrated device and the substrate, (iii) between the interconnect integrated device and the first integrated device, and (iv) between the interconnect integrated device and the second integrated device, and
wherein the underfill is a single underfill layer that directly touches (i) the first front side of the first integrated device, (ii) the second front side of the second integrated device and (iii) a surface of the substrate, and
wherein the underfill is further located in at least part of the cavity of the substrate.