US 12,354,996 B2
Glass carrier for die-up fan-out packaging and methods for making the same
Jin Su Kim, Seoul (KR); and Yu Xiao, Pittsford, NY (US)
Assigned to CORNING INCORPORATED, Corning, NY (US)
Appl. No. 17/435,574
Filed by CORNING INCORPORATED, Corning, NY (US)
PCT Filed Feb. 24, 2020, PCT No. PCT/US2020/019419
§ 371(c)(1), (2) Date Sep. 1, 2021,
PCT Pub. No. WO2020/180515, PCT Pub. Date Sep. 10, 2020.
Claims priority of provisional application 62/815,125, filed on Mar. 7, 2019.
Prior Publication US 2022/0149004 A1, May 12, 2022
Int. Cl. H01L 23/15 (2006.01); H01L 23/00 (2006.01)
CPC H01L 24/96 (2013.01) [H01L 23/15 (2013.01); H01L 24/19 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/15788 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A wafer- or panel-level encapsulated package comprising:
a glass substrate comprising a glass cladding layer fused to a glass core layer, the glass substrate comprising a cavity, wherein the glass cladding layer has a higher etch rate in an etchant than the glass core layer;
a microelectronic component disposed in the cavity;
an encapsulant sealed to the glass substrate such that the microelectronic component is encapsulated within the cavity, the encapsulant comprising an epoxy compound; and
wherein the wafer- or panel-level encapsulated package is free of adhesives between the cavity and the microelectronic component.
 
11. A method for forming a wafer- or panel-level encapsulated package, comprising:
etching a cavity into a glass substrate comprising a glass cladding layer fused to a glass core layer, wherein the glass cladding layer has a higher etch rate in an etchant than the glass core layer;
depositing a microelectronic component into the cavity;
sealing an encapsulant to the glass substrate such that the microelectronic component is encapsulated within the cavity, the encapsulant comprising an epoxy compound; and
wherein the wafer- or panel-level encapsulated package is free of adhesives between the cavity and the microelectronic component.