US 12,354,993 B2
Semiconductor device with having a spring portion
Shun Takeda, Yokohama Kanagawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP); and TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo (JP)
Filed on Sep. 2, 2022, as Appl. No. 17/902,778.
Claims priority of application No. 2022-040271 (JP), filed on Mar. 15, 2022.
Prior Publication US 2023/0299039 A1, Sep. 21, 2023
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/72 (2013.01) 21 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor circuit having an electrode on a first surface;
a case part surrounding the semiconductor circuit; and
a matching part including an insulating material, a signal terminal on an outside of the insulating material, and a lead on the inside of a portion of the insulating material, the lead being that is electrically connected to the signal terminal, wherein
the case part has a sidewall that extends in a first direction from the first surface,
the sidewall includes a receiving portion that is recessed convexly in a second direction parallel to the first surface into the sidewall,
the matching part includes a mating portion that is configured to fit into the receiving portion when the case part and matching part are engaged with one another and attached after being pressed together,
the mating portion consists of the insulating material,
a portion of the receiving portion is above the mating portion in the first direction after the case part and matching part are attached, and
the lead includes a contact portion that is in contact with the electrode when the matching part is attached to the case part, a first portion connecting between the signal terminal and the contact portion, and a spring portion between the first portion and the contact portion.