US 12,354,967 B2
Chip package assembly, electronic device, and preparation method of chip package assembly
Zhaozheng Hou, Dongguan (CN); Xiaojing Liao, Shanghai (CN); and Hao Peng, Shanghai (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., GuangDong (CN)
Filed on Jul. 25, 2022, as Appl. No. 17/872,473.
Claims priority of application No. 202110845274.0 (CN), filed on Jul. 26, 2021.
Prior Publication US 2023/0021432 A1, Jan. 26, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/552 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4871 (2013.01); H01L 21/6835 (2013.01); H01L 23/3672 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 23/562 (2013.01); H01L 23/564 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/214 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/351 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A chip package assembly, comprising:
a package substrate comprising an upper thermally conductive layer, a lower thermally conductive layer, and a thermally conductive part connected between the upper thermally conductive layer and the lower thermally conductive layer;
a chip comprising a front electrode and a back electrode disposed opposite to each other, wherein the chip is embedded in the package substrate, the thermally conductive part surrounds the chip, the front electrode is connected to the lower thermally conductive layer, and the back electrode is connected to the upper thermally conductive layer; and
a heat dissipation part connected to a surface of the upper thermally conductive layer that is away from the chip, wherein
the heat dissipation part comprises a plurality of heat dissipation protuberances, each of the plurality of heat dissipation protuberances are connected to the upper conductive layer, and the plurality of heat dissipation protuberances are spaced from each other, and
wherein an extension direction of some heat dissipation protuberances is a first direction, an extension direction of some other heat dissipation protuberances is a second direction, and the first direction is different from the second direction.