US 12,354,964 B1
Under chip bridge
Sean Thorne, Colorado Springs, CO (US); and Mike Newman, Haywards Heath (GB)
Assigned to FRONTGRADE TECHNOLOGIES INC., Colorado Springs, CO (US)
Filed by FRONTGRADE TECHNOLOGIES INC., Colorado Springs, CO (US)
Filed on Aug. 2, 2022, as Appl. No. 17/879,308.
Int. Cl. H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01); H01L 21/48 (2006.01)
CPC H01L 23/5381 (2013.01) [H01L 21/563 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 21/4846 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16221 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81908 (2013.01); H01L 2224/94 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An under chip bridge system-in-package comprising:
a first die;
a second die;
a substrate having a first surface, wherein the first surface of the substrate is connected to the first die and the second die with a plurality of connections, wherein the first surface of the substrate is flat, and wherein a thickness of the plurality of connections to the first and the second die are the same height;
a bridge comprising a first surface, wherein the first surface of the bridge is connected the first die and to the second die, wherein the thickness of the plurality of connections to the first die and the thickness of the plurality of connections to the second die are the same height, wherein the bridge has a thickness and the bridge thickness is uniform for an entirety of the bridge, and wherein the thickness of the bridge is less than the thickness of the plurality of connections between the substrate and the first die;
a third die;
a second bridge comprising a first surface, wherein the first surface of the second bridge is connected the first die and to the third die, wherein the second bridge has a thickness and the second bridge thickness is uniform for the entirety of the second bridge, and wherein the thickness of the second bridge is less than the thickness of the plurality of connection between the substrate and the first die; and
wherein a portion of the second bridge is located between a portion of the bridge and the substrate.