US 12,354,941 B2
Chip package structure and storage system
Shu-Liang Ning, Hefei (CN); Jun He, Hefei (CN); Jie Liu, Hefei (CN); and Zhan Ying, Hefei (CN)
Assigned to CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Filed by CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Filed on Jun. 20, 2022, as Appl. No. 17/844,200.
Application 17/844,200 is a continuation of application No. PCT/CN2022/082017, filed on Mar. 21, 2022.
Claims priority of application No. 202210038562.X (CN), filed on Jan. 13, 2022.
Prior Publication US 2023/0223326 A1, Jul. 13, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 23/48 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/49822 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 25/0652 (2013.01); H01L 23/481 (2013.01); H01L 24/09 (2013.01); H01L 24/13 (2013.01); H01L 24/80 (2013.01); H01L 24/81 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08148 (2013.01); H01L 2224/0913 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A chip package structure, comprising:
a chipset, wherein the chipset comprises a plurality of chips distributed horizontally;
a first Re-Distribution Layer (RDL) disposed on a first surface of the chipset; and
a bonding pad region, wherein the bonding pad region comprises a plurality of bonding pads, the plurality of bonding pads are located on a side surface of the first RDL away from the chipset, and the plurality of bonding pads are connected to the plurality of chips through the first RDL; wherein all bonding pads corresponding to the plurality of chips are centrally disposed in the bonding pad region;
wherein a horizontal area of the bonding pad region is less than or equal to a total horizontal area of the first surface of the chipset;
the horizontal area of the bonding pad region is less than or equal to a horizontal area of any one of the plurality of chips, and
an orthographic projection of the bonding pad region on the first surface is within an orthographic projection of one of the plurality of chips on the first surface.