US 12,354,932 B2
SMDs integration on QFN by 3D stacked solution
Cristina Somma, Cinisello Balsamo (IT); and Fulvio Vittorio Fontana, Monza (IT)
Assigned to STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed by STMICROELECTRONICS S.r.l., Agrate Brianza (IT)
Filed on Nov. 13, 2023, as Appl. No. 18/508,007.
Application 18/508,007 is a division of application No. 17/244,378, filed on Apr. 29, 2021, granted, now 11,842,948.
Application 17/244,378 is a division of application No. 16/782,797, filed on Feb. 5, 2020, granted, now 11,004,775, issued on May 11, 2021.
Application 16/782,797 is a division of application No. 15/925,420, filed on Mar. 19, 2018, granted, now 10,593,612, issued on Mar. 17, 2020.
Prior Publication US 2024/0096759 A1, Mar. 21, 2024
Int. Cl. H01L 23/495 (2006.01)
CPC H01L 23/49503 (2013.01) [H01L 23/49517 (2013.01); H01L 23/49575 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a leadrame including:
a die pad including:
a central raised region;
a first raised side region spaced apart from the central raised region, the first raised region is on a first side of the central raised region;
a second raised side region spaced apart from the central raised region, the second raised side region being on a second side of the central raised region opposite to the first side of the central raised region;
a third raised region transverse to the first raised side region, the second raised side region, and the central raised region, the third raised region being at first ends of the first raised side region, the second raised side region, and the central raised region;
a fourth raised region transverse to the first raised side region, the second raised side region, and the central raised region, the fourth raised region being at second ends of the first raised side region, the second raised side region, and the central raised region opposite to corresponding ones of the first ends of the first raised side region, the second raised side region, and the central raised region;
a first recess between the central raised region and the first raised side region; and
a second recess between the central raised region and the second raised region;
a first lead spaced apart from the first raised side region, the first lead being on the first side of the central raised region; and
a second lead spaced apart from the second raised side region, the second lead being on the second side of the central raised region.