US 12,354,930 B2
Module with substrate recess for conductive-bonding component
Leo Gu, Suzhou (CN); Sixin Ji, NanTong (CN); Jie Chang, Suzhou (CN); Keunhyuk Lee, Suzhou (CN); and Yong Liu, Cumberland Foreside, ME (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Oct. 2, 2023, as Appl. No. 18/479,565.
Application 18/479,565 is a division of application No. 17/247,525, filed on Dec. 15, 2020, granted, now 11,776,871.
Prior Publication US 2024/0030093 A1, Jan. 25, 2024
Int. Cl. H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/3735 (2013.01) [H01L 21/4871 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/83815 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method, comprising:
forming a recess and a mesa in a metal layer associated with a substrate such that the recess is in fluid communication with an overflow recess that extends from the recess and is a same width as the recess;
disposing a first portion of a conductive-bonding component on the mesa and a second portion of the conductive-bonding component in the recess; and
disposing an aluminum spacer on the conductive-bonding component such that the second portion of the conductive-bonding component is disposed between an edge of the aluminum spacer and a bottom surface of the recess.