US 12,354,928 B2
Semiconductor device and manufacturing method thereof
Shu-Shen Yeh, Taoyuan (TW); Po-Yao Lin, Hsinchu County (TW); Hui-Chang Yu, Hsinchu County (TW); Shyue-Ter Leu, Hsinchu (TW); and Shin-Puu Jeng, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 23, 2024, as Appl. No. 18/644,068.
Application 18/644,068 is a continuation of application No. 18/321,739, filed on May 22, 2023, granted, now 11,996,346.
Application 18/321,739 is a continuation of application No. 17/184,497, filed on Feb. 24, 2021, granted, now 11,699,631, issued on Jul. 11, 2023.
Prior Publication US 2024/0274493 A1, Aug. 15, 2024
Int. Cl. H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3675 (2013.01) [H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/35121 (2013.01); H01L 2924/37001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first semiconductor die and a second semiconductor die; and
a package lid, disposed over the first semiconductor die and the second semiconductor die, wherein the package lid comprises:
a roof extending along a first direction and a second direction perpendicular to the first direction and comprising a first portion and a second portion;
an island, protruding from the first portion of the roof, wherein the island covers and is thermally connected to the first semiconductor die, and the second portion of the roof covers and is physically separated from the second semiconductor die; and
a footing, disposed at a peripheral edge of the roof and protruding from the roof along a third direction perpendicular to the first direction and the second direction, wherein the island is disconnected from the footing along the second direction, and the island is physically connected to the footing along the first direction.