US 12,354,927 B2
Semiconductor device
Wensen Hung, Hsinchu County (TW); Yih-Ting Shen, Changhua County (TW); Jia-Syuan Li, Taoyuan (TW); and Tsung-Yu Chen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 22, 2022, as Appl. No. 17/700,498.
Claims priority of provisional application 63/242,049, filed on Sep. 9, 2021.
Prior Publication US 2023/0071542 A1, Mar. 9, 2023
Int. Cl. H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3675 (2013.01) [H01L 23/49833 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1611 (2013.01); H01L 2924/1616 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/182 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a package comprising a packaging substrate, semiconductor dies and an insulating encapsulation, wherein the semiconductor dies are disposed on and electrically connected to the packaging substrate, and the insulating encapsulation encapsulates the semiconductor dies;
a lid disposed on the packaging substrate, the lid comprising a rectangular cover portion and foot portion extending from the rectangular cover portion to the packaging substrate, wherein the rectangular cover portion covers the semiconductor dies and the insulating encapsulation, the foot portion comprises foot segments laterally spaced apart from one another, and the foot segments are attached to the packaging substrate, and wherein the foot segments comprise first foot segments arranged along a pair of short sides of the rectangular cover portion and second foot segments arranged along a pair of long sides of the rectangular cover portion, the first foot segments provide a first stiffness, and the second foot segments provide a second stiffness greater than the first stiffness; and
a thermal interface material, wherein the rectangular cover portion of the lid is attached to the package through the thermal interface material.