US 12,354,922 B2
Contamination detection method
Honglin Guo, Dallas, TX (US); and Robert M. Higgins, Plano, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on May 17, 2022, as Appl. No. 17/746,655.
Prior Publication US 2023/0378005 A1, Nov. 23, 2023
Int. Cl. H01L 21/66 (2006.01)
CPC H01L 22/34 (2013.01) 15 Claims
OG exemplary drawing
 
1. A method of forming an integrated circuit, the method comprising:
forming a first doped region of a detection structure on a substrate, the first doped region comprises a first doping conductivity type;
forming a first capacitor of the detection structure, comprising:
forming a second doped region of a second doping conductivity type opposite the first doping conductivity type, the second doped region laterally surrounded by the first doped region, wherein the second doped region comprises a top surface area smaller than a top surface area of the first doped region;
forming a dielectric layer on the second doped region; and
forming an electrode disposed on the dielectric layer;
performing parametric testing on the first capacitor over a plurality of breakdown voltages; and
determining gate oxide integrity of the first capacitor as a result of performing the parametric testing over the plurality of breakdown voltages.