US 12,354,919 B2
Manufacturing method of package circuit
Yeong-E Chen, Miao-Li County (TW); Bi-Ly Lin, Miao-Li County (TW); Kuang Chiang Huang, Miao-Li County (TW); and Yu Ting Liu, Miao-Li County (TW)
Assigned to Innolux Corporation, Miaoli County (TW)
Filed by Innolux Corporation, Miao-Li County (TW)
Filed on Nov. 4, 2021, as Appl. No. 17/519,540.
Claims priority of application No. 202011389533.5 (CN), filed on Dec. 1, 2020.
Prior Publication US 2022/0173000 A1, Jun. 2, 2022
Int. Cl. H01L 21/66 (2006.01); H01L 23/00 (2006.01); G02F 1/1339 (2006.01)
CPC H01L 22/14 (2013.01) [H01L 22/12 (2013.01); H01L 24/03 (2013.01); G02F 1/1339 (2013.01); H01L 2224/03001 (2013.01); H01L 2224/037 (2013.01); H01L 2224/117 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A manufacturing method of a package circuit, comprising:
forming a circuit structure comprising a plurality of conductive pads on a substrate;
forming a liquid crystal layer on the circuit structure, wherein the liquid crystal layer contacts the circuit structure;
performing an inspection step comprising:
determining conductivity of the plurality of the conductive pads according to a result of a rotation of the liquid crystal layer oriented with an electric field; and
removing the liquid crystal layer after the inspection step is performed,
wherein the manufacturing method further comprises:
forming a sealant on the circuit structure, so that the sealant surrounds the liquid crystal layer and the plurality of the conductive pads; and
forming a transparent conductive layer on the liquid crystal layer and the sealant,
wherein, in a normal direction of the substrate, a maximum height of the sealant is greater than a maximum height of the liquid crystal layer.