US 12,354,902 B2
Wafer processing method
Jinyan Zhao, Tokyo (JP); and Shigenori Harada, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Apr. 13, 2022, as Appl. No. 17/659,103.
Claims priority of application No. 2021-080423 (JP), filed on May 11, 2021.
Prior Publication US 2022/0367231 A1, Nov. 17, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/6836 (2013.01) [H01L 21/78 (2013.01); H01L 2221/68336 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wafer processing method comprising:
an affixing step of affixing a wafer to a sheet via a die attach layer having a diameter larger than a diameter of the wafer, to thereby form a protruding portion of the die attach layer on a periphery of the wafer;
a protruding portion removing step of removing the protruding portion from the sheet by bringing a removing member into contact with the protruding portion; and
an expanding step of expanding the sheet in a state in which the protruding portion has been removed from the sheet.