US 12,354,867 B2
Particle removal apparatus
Siao-Chian Huang, Hsinchu (TW); Po-Chung Cheng, Zhongpu Shiang (TW); Ching-Juinn Huang, Changhua (TW); Tzung-Chi Fu, Miaoli (TW); and Tsung-Yen Lee, Jhudong Township, Hsinchu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 15, 2024, as Appl. No. 18/635,294.
Application 17/371,285 is a division of application No. 16/182,771, filed on Nov. 7, 2018, granted, now 11,062,898, issued on Jul. 13, 2021.
Application 18/635,294 is a continuation of application No. 17/371,285, filed on Jul. 9, 2021, granted, now 11,984,314.
Claims priority of provisional application 62/711,678, filed on Jul. 30, 2018.
Prior Publication US 2024/0258095 A1, Aug. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/02 (2006.01); B08B 3/08 (2006.01); B08B 5/04 (2006.01); G03F 7/00 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/02057 (2013.01) [B08B 3/08 (2013.01); B08B 5/04 (2013.01); G03F 7/70925 (2013.01); H01L 21/67023 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A particle removal apparatus, comprising:
a reticle holder, configured to hold a reticle;
a robotic arm, comprising a first holding arm and a second holding arm; and
a particle removal device, disposed on the robotic arm, wherein the particle removal device comprises a solution spraying module, a sucking module, and a baffle;
wherein the first holding arm and the particle removal device are configured to align with a particle on a backside of the reticle, and the solution spraying module is disposed on the first holding arm and is configured to spray a solution onto the particle to remove the particle,
wherein the baffle is disposed on the second holding arm, and the baffle comprises a first section, a second section and a support section, wherein the first section and the second section are connected to the support section, wherein the solution spraying module is located between the first section, the second section and the support section, wherein the baffle is configured to be disposed over the backside of the reticle, wherein the sucking module is configured to suck the solution on the reticle with the particles being removed,
wherein the first section, the second section and the support section of the baffle define an enclosed area that encompasses the particle to be removed, wherein the sucking module comprises a plurality of sucking holes, and the sucking holes are formed on an inner surface of the baffle, and the solution in the enclosed area is directed towards the sucking holes.