US 12,354,850 B2
Apparatus and method for processing substrate
Woo Duck Jung, Yongin-si (KR); Jeong Hee Jo, Yongin-si (KR); Ryong Hwang, Yongin-si (KR); Se Jong Sung, Yongin-si (KR); Woong Joo Jang, Yongin-si (KR); and Sang Soon Jung, Yongin-si (KR)
Assigned to EUGENE TECHNOLOGY CO., LTD., Yongin-si (KR)
Filed by EUGENE TECHNOLOGY CO., LTD., Yongin-si (KR)
Filed on Jan. 27, 2023, as Appl. No. 18/160,812.
Claims priority of application No. 10-2022-0013374 (KR), filed on Jan. 28, 2022.
Prior Publication US 2023/0245867 A1, Aug. 3, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32715 (2013.01) [H01J 2237/026 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An apparatus for processing substrate comprising:
a susceptor; and
a cover unit installed on an upper part of the susceptor to cover the upper part of the susceptor, the substrate being placed on top of the cover unit,
wherein the cover unit comprises:
a cover frame having one or more air gaps positioned below the substrate; and
one or more covers having a shape corresponding to each of the air gaps and mountable in each of the air gaps,
wherein a depth of the air gap is at least three times the thickness of the substrate.