US 12,354,848 B2
Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
Yasunori Ejiri, Toyama (JP)
Assigned to Kokusai Electric Corporation, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Feb. 3, 2023, as Appl. No. 18/105,404.
Application 18/105,404 is a continuation of application No. PCT/JP2021/035033, filed on Sep. 24, 2021.
Claims priority of application No. 2020-159571 (JP), filed on Sep. 24, 2020.
Prior Publication US 2023/0187180 A1, Jun. 15, 2023
Int. Cl. H01J 37/32 (2006.01); H01L 21/687 (2006.01)
CPC H01J 37/32642 (2013.01) [H01J 37/32449 (2013.01); H01J 37/32541 (2013.01); H01J 37/32568 (2013.01); H01J 37/32577 (2013.01); H01J 37/32715 (2013.01); H01J 37/32825 (2013.01); H01J 37/32834 (2013.01); H01L 21/68757 (2013.01); H01L 21/68764 (2013.01); H01J 2237/3323 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a process chamber;
a process gas supplier through which a process gas is supplied into the process chamber;
an exhauster through which an inner atmosphere of the process chamber is exhausted;
a remote plasma generating structure configured to supply a plasma into the process chamber;
a boat configured to accommodate a plurality of substrates in the process chamber;
a rotary shaft configured to rotatably support the boat;
an internal conductor provided inside the rotary shaft;
a DC power supply configured to supply a DC bias to the internal conductor; and
a boat support base configured to support the boat and to electrically connect the boat and the internal conductor, the boat comprising:
an insulating structure provided at an upper end of the rotary shaft and configured to support the boat on an upper surface thereof; and
a metal structure embedded in the insulating structure in a manner that an entire side peripheral surface of the metal structure is in contact with an covered by the insulating structure,
wherein the boat as a whole is made of a non-metallic material, at least a part of a surface of the boat is conductive, and the boat is configured to electrically connect the internal conductor and the plurality of substrates.