US 12,354,847 B2
Methods and apparatus for conductance liners in semiconductor process chambers
Timothy Joseph Franklin, Campbell, CA (US); Rajinder Dhindsa, Pleasanton, CA (US); Daniel Sang Byun, Campbell, CA (US); and Carlaton Wong, Sunnyvale, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on Mar. 12, 2020, as Appl. No. 16/816,672.
Prior Publication US 2021/0285101 A1, Sep. 16, 2021
Int. Cl. H01J 37/32 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); C23C 16/505 (2006.01); H01L 21/67 (2006.01)
CPC H01J 37/32623 (2013.01) [C23C 16/4405 (2013.01); C23C 16/4585 (2013.01); H01J 37/32853 (2013.01); C23C 16/505 (2013.01); H01L 21/67069 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for processing substrates, comprising:
a process chamber with a process volume and an upper electrode positioned in a top of the process chamber;
a conductance liner surrounding the process volume that is configured to confine plasma and configured to provide an RF ground return path, the conductance liner having at least one fixed portion that is completely annular in a plan view and a movable portion that is completely annular in a plan view, the movable portion configured to expose a substrate transfer slot in a wall of the process chamber, wherein the at least one fixed portion has a first vertical portion with a top interconnecting with a first horizontal portion at a top of the process chamber, wherein the first horizontal portion extends inward of an innermost vertical surface of the first vertical portion towards an outermost edge of the upper electrode, forming an annular ring, and wherein an innermost edge of the first horizontal portion is directly adjacent to the outermost edge of the upper electrode; and
a lifting assembly with an actuator attached to the movable portion of the conductance liner, the lifting assembly configured to move the movable portion of the conductance liner in a vertical direction.