US 12,354,843 B2
Process chamber process kit with protective coating
Jian Wu, San Jose, CA (US); Wei Liu, San Jose, CA (US); Theresa Kramer Guarini, San Jose, CA (US); Linlin Wang, Fremont, CA (US); Malcolm Bevan, Santa Clara, CA (US); and Lara Hawrylchak, Gilroy, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 21, 2019, as Appl. No. 16/418,274.
Claims priority of provisional application 62/685,098, filed on Jun. 14, 2018.
Prior Publication US 2019/0385825 A1, Dec. 19, 2019
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32495 (2013.01) [H01J 37/32477 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A chamber component used within a plasma processing chamber, comprising:
a metallic base material comprising a roughened non-planar surface, wherein the roughened non-planar surface is a metallic surface of the metallic base material, and the roughened non-planar surface has an average surface roughness (Ra) of between 4 micro-inches and 80 micro-inches; and
a silica coating formed over the roughened non-planar surface, wherein:
the silica coating has a surface that has an Ra that is less than the Ra of the roughened non-planar surface,
the silica coating has a thickness between about 0.2 microns and about 10 microns,
the silica coating has less than 1% porosity by volume, and
the formed silica coating blocks aluminum atoms from leaching from the metallic base material and into the formed silica coating such that the surface of the formed silica coating contains more than 0 atoms/centimeters2 of aluminum and less than 2E12 atoms/centimeters2 of aluminum.