US 12,354,842 B2
In-situ focus ring coating
Minjoon Park, Albany, NY (US); and Andrew Metz, Albany, NY (US)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jan. 19, 2023, as Appl. No. 18/156,917.
Prior Publication US 2024/0249921 A1, Jul. 25, 2024
Int. Cl. H01L 21/311 (2006.01); H01J 37/32 (2006.01)
CPC H01J 37/32477 (2013.01) [H01J 37/32642 (2013.01); H01J 37/32743 (2013.01); H01J 37/32807 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01J 37/32091 (2013.01); H01J 37/3288 (2013.01); H01J 2237/201 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/334 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of etching a substrate, the method comprising:
loading the substrate into a plasma etch chamber, the plasma etch chamber comprising a focus ring surrounding the substrate, the focus ring comprising a bulk material and a surface layer, the surface layer comprising a refractory metal;
flowing a process gas comprising fluorine and carbon into the plasma etch chamber;
coating a carbide layer over the surface layer of the focus ring, the coating comprising exposing the focus ring to a plasma generated from the process gas in the plasma etch chamber, the carbide layer comprising a carbide of the refractory metal; and
etching the substrate, the etching comprising exposing the substrate to the plasma.