US 12,354,810 B2
Wound capacitor package structure
Chieh Lin, Hsinchu County (TW); Chung-Jui Su, Kaohsiung (TW); and Cheng-Hao Lu, Miaoli County (TW)
Assigned to APAQ TECHNOLOGY CO., LTD., Miaoli County (TW)
Filed by APAQ TECHNOLOGY CO., LTD., Miaoli County (TW)
Filed on Feb. 17, 2023, as Appl. No. 18/170,536.
Claims priority of application No. 111142746 (TW), filed on Nov. 9, 2022.
Prior Publication US 2024/0153708 A1, May 9, 2024
Int. Cl. H01G 9/10 (2006.01); H01G 9/012 (2006.01); H01G 9/15 (2006.01)
CPC H01G 9/012 (2013.01) [H01G 9/10 (2013.01); H01G 9/151 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wound capacitor package structure, comprising:
a wound assembly including a wound positive conductive foil, a wound negative conductive foil and two wound insulating separators;
a conductive assembly including a first conductive pin electrically contacting the wound positive conductive foil and a second conductive pin electrically contacting the wound negative conductive foil;
a package assembly configured for enclosing the wound assembly;
a bottom seat plate disposed on a bottom side of the package assembly for carrying the package assembly; and
a pin protection assembly including a first pin protection layer configured to cover a portion of the first conductive pin, and a second pin protection layer configured to cover a portion of the second conductive pin;
wherein one of the two wound insulating separators is disposed between the wound positive conductive foil and the wound negative conductive foil, and one of the wound positive conductive foil and the wound negative conductive foil is disposed between the two wound insulating separators;
wherein the first conductive pin includes a first embedded portion accommodated inside the package assembly and a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second embedded portion accommodated inside the package assembly and a second exposed portion exposed outside the package assembly;
wherein the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin are exposed from the bottom seat plate, and the first pin protection layer and the second pin protection layer are respectively disposed on the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin;
wherein, when the first exposed portion of the first conductive pin is bent to form a first bending section and a first extending section connected to the first bending section, the first pin protection layer is configured to surround and cover the first bending section of the first exposed portion of the first conductive pin;
wherein, when the second exposed portion of the second conductive pin is bent to form a second bending section and a second extending section connected to the second bending section, the second pin protection layer is configured to surround and cover the second bending section of the second exposed portion of the second conductive pin.