US 12,354,808 B2
Multilayer electronic component
Kwang Dong Seong, Suwon-si (KR); Young Ah Song, Suwon-si (KR); Bong Gyu Choi, Suwon-si (KR); Do Kyeong Lee, Suwon-si (KR); Jae Hoon Bang, Suwon-si (KR); and Wan Sik Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jun. 16, 2023, as Appl. No. 18/210,936.
Claims priority of application No. 10-2023-0027755 (KR), filed on Mar. 2, 2023.
Prior Publication US 2024/0296996 A1, Sep. 5, 2024
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/2325 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the body and connected to the internal electrode,
wherein the external electrode includes a conductive metal and glass, and
wherein at least a portion of the glass includes a secondary phase including barium (Ba), aluminum (Al), and silicon (Si).