| CPC H01G 4/30 (2013.01) [H01G 4/12 (2013.01); H01G 4/2325 (2013.01)] | 20 Claims |
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1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first base electrode layer disposed on the third surface, a first intermediate electrode layer disposed on the first base electrode layer, and a first conductive resin layer disposed on the first intermediate electrode layer and extending to the first and second surfaces; and
a second external electrode including a second base electrode layer disposed on the fourth surface, a second intermediate electrode layer disposed on the second base electrode layer, and a second conductive resin layer disposed on the second intermediate electrode layer and extending to the first and second surfaces,
wherein the first and second base electrode layers include glass and Ni, the first and second intermediate electrode layers include an alloy containing Sn and Ni, and the first and second conductive resin layers include a resin and a metal, and
wherein the first and second intermediate electrode layers further include a first layer including the alloy, and a second layer disposed on the first layer and including Sn.
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