| CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/2325 (2013.01)] | 46 Claims |

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1. A multilayer electronic component, comprising:
a body including a dielectric layer, first and second internal electrodes, alternately disposed with the dielectric layer disposed therebetween, first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first base electrode layer disposed on the third surface and including a first connection portion connected to the first internal electrode;
a second base electrode layer disposed on the fourth surface and including a second connection portion connected to the second internal electrode;
a first electrode layer disposed on a region including the third surface and the first surface, and formed to expose at least a portion of the first connection portion; and
a second electrode layer disposed on a region including the fourth surface and the first surface, and formed to expose at least a portion of the second connection portion,
wherein the first and second base electrode layers include Cu, and the first and second electrode layers include Ag, and
wherein an outermost portion of at least one of the first base electrode layer or the second base electrode layer in the second direction is outward of a portion of the first electrode layer disposed on the third surface or a portion of the second electrode layer disposed on the fourth surface, respectively, or wherein a portion of the first electrode layer or second electrode layer extending from the first surface to respectively the third or fourth surface has a decreasing thickness.
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