US 12,354,804 B2
Multilayer ceramic electronic device
Tomoaki Nakamura, Tokyo (JP); Mikio Tahara, Tokyo (JP); Hiroki Shimizu, Tokyo (JP); Masaru Saito, Tokyo (JP); and Tomio Inoue, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Jul. 31, 2023, as Appl. No. 18/362,531.
Claims priority of application No. 2022-134234 (JP), filed on Aug. 25, 2022.
Prior Publication US 2024/0071688 A1, Feb. 29, 2024
Int. Cl. H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/248 (2013.01) [H01G 4/30 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic device comprising:
a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers facing each other through each of the plurality of dielectric layers;
an external electrode that is provided on an end face of the multilayer chip in a second direction orthogonal to a first direction in which the plurality of internal electrode layers face each other, and has a plurality of glass portions that are spaced from each other on a surface of the external electrode; and
a plated layer that is provided on the external electrode and has discontinuous portions on the plurality of glass portions.