| CPC H01G 4/2325 (2013.01) [H01G 4/012 (2013.01); H01G 4/224 (2013.01); H01G 4/30 (2013.01)] | 31 Claims |
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1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed while having the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface;
a first insulating layer disposed on the first connection portion;
a second insulating layer disposed on the second connection portion;
a first plating layer disposed on the first band portion; and
a second plating layer disposed on the second band portion,
wherein an end of the first insulating layer and an end of the first plating layer are in contact with each other at a first contact point on the first external electrode, and an end of the second insulating layer and an end of the second plating layer are in contact with each other at a second contact point on the second external electrode,
t3/t2≤⅕ when ‘t2’ indicates an average thickness of the first or second insulating layer, and ‘t3’ indicates an average size of the first or second insulating layer in the second direction, measured from a point positioned on an outermost tip in the second direction among contact points between the end of the first or second plating layer and the end of the first or second insulating layer to an outer surface of the first or second external electrode, and
H1<H2 in which ‘H1’ indicates an average size of a region in the first direction, measured from the first surface to an internal electrode disposed closest to the first surface among the first and second internal electrodes, and ‘H2’ indicates an average size of the first or second plating layer in the first direction, measured from an extension line of the first surface to the end of the first or second plating layer disposed on the first or second connection portion.
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