US 12,354,800 B2
Multilayer capacitor and method of manufacturing the same
Yun Sung Kang, Suwon-si (KR); Min Jung Cho, Suwon-si (KR); and Yun Hee Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 24, 2024, as Appl. No. 18/673,694.
Application 18/673,694 is a continuation of application No. 18/200,309, filed on May 22, 2023, granted, now 12,027,315.
Application 18/200,309 is a continuation of application No. 17/320,966, filed on May 14, 2021, granted, now 11,694,843, issued on Jul. 4, 2023.
Claims priority of application No. 10-2020-0146115 (KR), filed on Nov. 4, 2020.
Prior Publication US 2024/0312708 A1, Sep. 19, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/248 (2006.01)
CPC H01G 4/0085 (2013.01) [H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A multilayer capacitor comprising:
a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween;
external electrodes disposed on the body and connected to the internal electrodes; and
an insulating layer covering a surface of the body,
wherein the insulating layer includes an oxide of a metal included the at least one of the external electrodes, and
the insulating layer is also disposed in a groove in the surface of the body.