US 12,354,784 B2
Coil component
Jeong Gu Yeo, Suwon-si (KR); Young Il Lee, Suwon-si (KR); and Byeong Cheol Moon, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 10, 2023, as Appl. No. 18/095,172.
Application 18/095,172 is a continuation of application No. 16/673,328, filed on Nov. 4, 2019, granted, now 11,581,125.
Claims priority of application No. 10-2019-0079989 (KR), filed on Jul. 3, 2019.
Prior Publication US 2023/0162908 A1, May 25, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 27/28 (2006.01); H01F 27/02 (2006.01); H01F 27/255 (2006.01); H01F 27/29 (2006.01); H01F 41/02 (2006.01)
CPC H01F 27/29 (2013.01) [H01F 27/02 (2013.01); H01F 27/255 (2013.01); H01F 41/0246 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A coil component, comprising:
a body including magnetic metal powder, and having a molded portion and a cover portion with a recess in which a portion of the molded portion is disposed;
a winding coil disposed in the body and wound around a winding axis;
first and second external electrodes connecting with the winding coil; and
a layer disposed between the cover portion and the molded portion,
wherein end portions of the layer extend in a direction of the winding axis to be exposed ona surface of the molded portion, on which the first and second external electrodes are disposed, to contact the first and second external electrodes, respectively.