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1. A positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance, comprising a barium lead titanate-based and sintered thermal sensitive ceramic plate and metal ohmic electrodes located at two sides of the thermal sensitive ceramic plate, wherein the positive temperature coefficient ceramic thermistor element further comprises a microporous channel barrier layer, the microporous channel barrier layer comprises a glass sealing layer or an organic sealant, and, in the case that the microporous channel barrier layer is a glass sealing layer, the glass sealing layer is cladded on the outer surfaces of the thermal sensitive ceramic plate entirely, and the metal ohmic electrodes are bonded to the two sides of the glass sealing layer; whereas in the case that the microporous channel barrier layer is an organic sealant, the organic sealant is filled in micropores in the surfaces of the metal ohmic electrodes bonded to the two sides of the thermal sensitive ceramic plate, and the voids in the surfaces of peripheral edge regions of the thermal sensitive ceramic plate where no metal ohmic electrode is arranged are sealed at the same time; the glass sealing layer is obtained from glass paste for cladding, the glass paste for cladding is prepared as follows: preparing glass micro-powder in particle size smaller than 500 nm through a melting and water quenching process, while an organic substance is added therein and mixed at the same time, so as to obtain the glass paste for cladding for the glass sealing layer that is used as the microporous channel barrier layer; a mass ratio of the glass micro-powder in particle size smaller than 500 nm to the organic substance is 1:1.2, and the organic substance consists of the following raw materials in parts by weight (pbw): 0.1 to 0.3 pbw adhesive, 0.001 to 0.01 pbw dispersant, and 1 pbw solvent; the adhesive is PVB, the dispersant is low molecular wax, and the solvent is acetone; after the glass paste for cladding is cladded on the surface of the thermal sensitive ceramic plate by either method of impregnation method or spraying method, the thermal sensitive ceramic plate is placed in a high-temperature heat treatment device and heat-treated at 500 to 600° C. for 8 to 12 minutes; the glass sealing layer is a glass sealing layer of a glass system, the glass system consists of the following raw materials at the following molar ratio: K2SiF6+ZnO+AL2O3+SiO2+aM+N+βP, where M is Na2O+K2O and α=0.1 to 0.3; N is one of B2O3, Li2O and V2O5 or a combination thereof, and the total amount is one mole; P is MnO2, Fe3O4 or Co3O4, and β=0.001 to 0.01; the filling and sealing method for filing the organic sealant in the micropores in the surfaces of the metal ohmic electrodes bonded to the two sides of the thermal sensitive ceramic plate and scaling the voids in the surfaces of peripheral edge regions of the thermal sensitive ceramic plate where no metal ohmic electrode is arranged at the same time comprises either method of the following two methods: the first method: placing the thermal sensitive ceramic plate with the metal ohmic electrodes bonded on the two sides thereof into a hot isostatic press containing the organic sealant as a void sealing medium, applying pressure to the hot isostatic press, controlling the temperature of the void sealing medium as the pressure is applied, the applied pressure and the applied duration, and cleaning and drying the surfaces sequentially after the pressure application is finished; the second method: impregnating the thermal sensitive ceramic plate with the metal ohmic electrodes bonded on the two sides thereof in a container that contains the organic sealant, vacuumizing the container, controlling the degree of vacuum during vacuumizing and the impregnation duration, taking the ceramic plate out of the container after the bonding and vacuumizing, and cleaning and drying the surfaces sequentially; controlling the temperature of the void sealing medium during the application of pressure is that the temperature of the void scaling medium is controlled to be 100 to 200° C., controlling the applied pressure is that the pressure is controlled to be 1 to 10 MPa, and controlling the applied duration is that the applied duration is controlled to be 60 to 120 min.; controlling the degree of vacuum during the vacuumizing is that the degree of vacuum is controlled to be smaller than 10 KPa, and controlling the impregnation duration is that the impregnation duration is controlled to be 280 to 320 min.; and the surface cleaning is carried out with an ultrasonic cleaning machine; controlling the temperature of the void sealing medium during the application of pressure is that the temperature of the void sealing medium is controlled to be 100 to 200° C., controlling the applied pressure is that the pressure is controlled to be 1 to 10 MPa, and controlling the applied duration is that the applied duration is controlled to be 60 to 120 min.; controlling the degree of vacuum during the vacuumizing is that the degree of vacuum is controlled to be smaller than 10 KPa, and controlling the impregnation duration is that the impregnation duration is controlled to be 280 to 320 min.; and the surface cleaning is carried out with an ultrasonic cleaning machine; the composition of raw materials of the organic sealant comprises: polydimethylsiloxane, nano-powder of a transition metal oxide, a crosslinking agent, a catalyst, and an organic solvent; the nano-powder of the transition metal oxide added into the polydimethylsiloxane is in an amount equal to 0.001-0.01% of the weight of the polydimethylsiloxane; the crosslinking agent is added in an amount equal to 1-3% of the weight of the polydimethylsiloxane; and the catalyst is added in an amount equal to 0.05-0.1% of the weight of the polydimethylsiloxane.
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