US 12,353,953 B2
Filter for laminated circuit assembly
John Martinis, Santa Barbara, CA (US); Bob Benjamin Buckley, Santa Barbara, CA (US); and Xiaojun Trent Huang, Santa Barbara, CA (US)
Assigned to GOOGLE LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on Sep. 16, 2021, as Appl. No. 17/476,606.
Claims priority of provisional application 63/079,258, filed on Sep. 16, 2020.
Prior Publication US 2022/0083891 A1, Mar. 17, 2022
Int. Cl. G06N 10/00 (2022.01); G02B 5/20 (2006.01)
CPC G06N 10/00 (2019.01) [G02B 5/207 (2013.01); G02B 5/208 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A laminated circuit assembly, comprising:
one or more signal lines disposed within a substrate in a first direction;
a dielectric portion of the substrate; and
a filter portion of the substrate extending in the first direction and containing a frequency absorbent material providing less attenuation to a first signal of a first frequency than to a second signal of a second, higher frequency;
wherein the filter portion is configured to attenuate infrared signals passing through the one or more signal lines, and
wherein the filter portion comprises boundaries defined by a cavity formed within the dielectric portion, wherein the cavity exposes at least one portion of the one or more signal lines, and wherein the cavity is at least partially filled with the frequency absorbent material such that the frequency absorbent material is in physical contact with the at least one portion of the one or more signal lines.